Pb-free products shown at APEX production trade show
25 February 2004
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Indium Corporation exhibited its latest lead-free (Pb-Free) soldering products at the recent APEX production trade show.
Currently over 5 million mobile phones have been produced with the company's NC-SMQ230 Pb-Free Solder Paste for SM. This solder paste is an air reflow, no-clean material specifically formulated to accommodate the high processing temperatures required by Sn/Ag/Cu and Sn/Ag Pb-Free alloy systems. According to Indium, NC-SMQ230 provides outstanding printing performance along with extended stencil life and tack time to handle the rigours of today's manufacturing environment. Pb-Free solder paste made with NC-SMQ230 recently received the Frost & Sullivan Product Innovation award.
PK-001 and PK-002 Flip-Chip Epoxy Fluxes are materials designed especially for use with Sn62 and Sn63 eutectic solders. PK-002 is specially designed for Pb-Free applications, while PK-001 and PK-002 are fast curing, halide-free, no-clean fluxes that can be used for Flip-Chip or CSP soldering processes. PK-001 and PK-002 have a stable thermoset residue, and are compatible with standard underfill materials, conformal coatings, and most finishes and coatings. They are also environmentally friendly.
Eutectic AuSn solder finds use in critical applications such as high-reliability medical, aerospace, and military applications, in die-attach and lid sealing, or as a braze alternative. Its relatively high melting point and exceptional joint strength make the alloy useful for certain applications, says the company.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, and die-attach materials. Factories are located in North America, Europe, and Asia.
For more information contact Hawker Richardson, 011 792 2766.
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