10 March 2004Manufacturing / Production Technology, Hardware & Services
Information Security
As a result of recent environmental concerns regarding the use of lead, the requirements for lead-free semiconductors have been receiving increasing attention within the electronics industry. Current lead-free alternatives have a 30°C higher melting temperature than tin-lead solder, and strongly impact the required peak re-flow temperature (now 260°C vs 225°C for today's tin-lead alloys).
To cope with these new requirements and help its customers to implement a lead-free program, Infineon has released a new package for its MOSFETs in TO220 and TO262/3, which overcomes the well-known limitations faced under heavy stress conditions.
Key features are:
* No bond damage, wire necking, bond lifting, die lifting, delamination after MSL1 at 260°C.
* Green materials - no antimony III oxide, no halogens in the mould compound.
* Improved adhesion between the mould compound and the metallisation due to new inorganic adhesion promoter.
* Improved component and application reliability thanks to enhanced adhesion promoter.
Advanced X-ray inspection systems MyKay Tronics
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The Scienscope AXl-6100 series comprises specialised X-ray inspection systems explicitly engineered for the examination of long circuit boards.
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The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.
Read more...Non-contact linear position sensor Electrocomp
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The Vishay 40 LHE Linear Position Sensor, designed for industrial motion control and automation, delivers robust, non-contact measurement performance using Hall effect technology.
Read more...Disruption is the new normal. Effortless is the new competitive advantage. Seven Labs Technology
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Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.
Read more...71% of organisations suffered an identity breach
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The State of Identity Security 2026 report from Sophos finds human error and poor non-human identity management are the root causes of most attacks, as agentic AI accelerates the risk.
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