10 March 2004Manufacturing / Production Technology, Hardware & Services
Information Security
As a result of recent environmental concerns regarding the use of lead, the requirements for lead-free semiconductors have been receiving increasing attention within the electronics industry. Current lead-free alternatives have a 30°C higher melting temperature than tin-lead solder, and strongly impact the required peak re-flow temperature (now 260°C vs 225°C for today's tin-lead alloys).
To cope with these new requirements and help its customers to implement a lead-free program, Infineon has released a new package for its MOSFETs in TO220 and TO262/3, which overcomes the well-known limitations faced under heavy stress conditions.
Key features are:
* No bond damage, wire necking, bond lifting, die lifting, delamination after MSL1 at 260°C.
* Green materials - no antimony III oxide, no halogens in the mould compound.
* Improved adhesion between the mould compound and the metallisation due to new inorganic adhesion promoter.
* Improved component and application reliability thanks to enhanced adhesion promoter.
Claude Mythos wake-up call Technews Publishing
AI & Data Analytics Information Security
AI has crossed a critical cybersecurity threshold and frontier models are accelerating attack lifecycles and will enable attackers to identify and exploit vulnerabilities at scale and speed, through novel methods that were previously the domain of advanced nation-state entities.
Read more...If you cannot prove identity, you cannot claim security
Access Control & Identity Management Information Security
Cybersecurity planning for 2026 is a structural change in how attacks are executed and how trust is exploited, demanding that companies stop layering tools on top of infrastructure and instead prioritise intelligence and identity.
Read more...World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
Manufacturing / Production Technology, Hardware & Services
BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
Read more...Inline vapour phase soldering for high-volume production MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
Read more...Global electronics solutions since 1964 IMP Electronics Solutions
Manufacturing / Production Technology, Hardware & Services
Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version