Solder paste for high speed lines

24 March 2004 Manufacturing / Production Technology, Hardware & Services

A halide-free, air reflow, no-clean solder paste formulated to leave a benign, probe testable residue is available from Indium Corporation. The residue from the NC-SMQ92J solder paste is easily penetrated and will not clog multipoint probes. This product has other qualities such as consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting, according to the company.

NC- SMQ92J will perform well on high speed surface mount lines that use fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria.

Indium Corporation manufactures low oxide spherical powder composed of Sn-Pb and Sn-Pb-Ag in the industry standard Type 3 mesh size. The weight ratio of the flux/vehicle to the solder powder is referred to as the 'metal load' and is typically in the range of 85-92% for standard alloy compositions.

For more information contact Hawker Richardson, 011 792 2766.

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