Advanced packaging alternative to 'known good die'
24 March 2004Manufacturing / Production Technology, Hardware & Services
Actel has introduced an advanced packaging technology small enough to enable the assembly of tested and programmed FPGAs into multichip modules (MCMs) for applications in Space. Capable of delivering products with a form factor similar to bare die, the company says its new ceramic chip carrier land grid (CCLG) package eliminates the handling, testing and programming challenges associated with using known good die (KGD) in MCMs. The first product, the RT54SX32S-CC256M, is factory-tested at both extremes of the military temperature range and at room temperature prior to shipment. Custom-designed for its 32000-gate, radiation-tolerant, military temp. grade RT54SX32S device, the 17 x 17 mm CCLG256 package is 78% smaller than its predecessor, the CQFP256. The underside of the package is a 256-pad land grid array with 1,0 mm pad spacing.
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