PC/104 board the answer for power-sensitive embedded applications
5 May 2004Computer/Embedded Technology
Telecoms, Datacoms, Wireless, IoT
Small, mighty, and able to withstand extreme environmental conditions. This is how Ampro describes this member of its EBX product line: the Little Board 700. This is a good solution for OEMs who are looking for a rugged SBC that is economical, yet offers high performance and efficient power and heat usage, along with long-term availability.
The availability factor is crucial for OEMs in medical, military and regulated gaming markets who often face extensive qualification and regulatory procedures, says the company. They demand boards with long product lifecycles so that they do not have to go through a painful re-design or re-qualification process.
The board's low power dissipation is another big plus. The Low Voltage Pentium III processor with 512 KB cache at 933 MHz, offers reduced power dissipation compared to the previous-generation 850 MHz Socket 370 Pentium III processor. The power rating of 12,2 W is less than half of the 25,7 W rating of the Socket 370 Pentium III processor at 850 MHz. Offering fanless operation up to +70°C, extended temperature to +85°C, and conformal coating, the Little Board 700 allows OEMs to migrate to a high-performance single board computer without having to compromise the thermal design of their system.
This embedded single-board computer is full-featured with little board EBX form factor. It is available with a choice of Intel processors: The Low Voltage Pentium III processor with 512 KB cache at 933 MHz, the Celeron processor at 650 MHz, or the Celeron processor at 400 MHz. Application-ready, it supports popular operating systems including: Linux 2.4.18, VxWorks 2.5.5, QNX 6.2.1, and Windows CE.NET 4.1, 98se, 2000, ME, XP, XPe. Ampro's drivers are included in the Little Board 700 QuickStart Kits and Development Systems.
Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.
Read more...SDRs – Which RF architecture should you choose? RFiber Solutions
Editor's Choice Telecoms, Datacoms, Wireless, IoT
There are several common methods of implementing SDR architectures. This paper discusses which is best when meeting a specific need.
Read more...5G mobile hotspot with integrated multimodal AI capabilities CST Electronics
Computer/Embedded Technology
MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.
Read more...Panasonic TOUGHBOOK 33 2-in-1 detachable Vepac Electronics
Computer/Embedded Technology
The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.
Read more...SBC with 12 TOPS computing power iCorp Technologies
Computer/Embedded Technology
The QSM560DR series is Quectel’s multi-mode 5G smart control panel with built-in Ubuntu/Android/Windows operating system based on the Quectel SG560D series smart module.
Read more...High-performance µC series NuVision Electronics
Computer/Embedded Technology
GigaDevice has announced the official launch of the GD32F503/505 high-performance series of 32-bit general-purpose microcontrollers based on the Arm Cortex-M33 core.
Read more...Octa-core smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
Read more...Is it time for Wi-Fi 7 in SA? Technews Publishing
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7, the IEEE 802.11be standard also known as Extremely High Throughput, is the next-gen wireless networking standard designed to dramatically improve speed, latency, efficiency, and reliability.
Read more...The trends driving uptake of IoT Platform as a Service Trinity IoT
Editor's Choice Telecoms, Datacoms, Wireless, IoT
IoT platforms, delivered as a service, are the key that will enable enterprises to leverage a number of growing trends within the IT space, and access a range of benefits that will help them grow their businesses.
Read more...Vertiv expands rack PDU portfolio
Computer/Embedded Technology
Vertiv has announced its new Vertiv PowerIT rack power distribution units designed to address the rising power needs of data-intensive workloads, including AI and high-performance computing.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.