Infineon Technologies has shipped first samples of its 2 Gigabyte DDR2 Planar Registered dual inline memory modules (DIMMs). The modules use single-die 512 Megabit DDR2 memory chips in very compact FBGA packages and are based on a planar design. Currently available modules (above 1 GB) use stacked-die. The new planar solution is based on mature single-die components. Manufacturers will be able to benefit from considerably flatter modules which with a thickness of 4,1 mm to fulfil the requirements for DDR2 server applications, says Infineon. Depending on configuration, up to 10% reduced heat generation is obtained, it claims. These DIMMs are expected to become the preferred density of high-end server suppliers. They target high-performance data processing and storage applications in the server and storage infrastructure market.
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