Array package rework system has superior vision capability
19 May 2004Manufacturing / Production Technology, Hardware & Services
When it comes to reworking BGAs, CSPs, land grid arrays (LGAs), micro SMDs, micro-lead frames (MLFs) and bumped chip components, an important key to success is vision: the ability to see, align and accurately place components. According to Metcal, it is here that its APR-5000 Array Package Rework System excels. The system incorporates Metcal's exclusive integral vision system that makes accurate component placement easy to achieve, allowing operators to simultaneously view the topside of the PCB and a superimposed image of the underside of the component.
It has micrometer adjustment so that images can be accurately aligned in the x, y and theta axes prior to placement. In addition, integrating the vision system with the machine's software eliminates the need for multiple monitors.
The APR-5000 was developed in direct response to current production needs and future industry trends. The system is ergonomically designed to occupy the minimum bench footprint. In addition, the rework system uses standard mains voltages and self-contained pumps rather than special wiring and shop air. This allows the system to be set up and moved to any bench, rather than having to be fitted/plumbed in by an engineer.
To help guarantee uniformity and higher process yields, the APR-5000 Array Package Rework System has an integrated placement and reflow head that moves to the correct position for rework, eliminating the need for PCB movement during the process. The PCB is also centralised relative to the pre-heater for superior uniformity of PCB temperature during rework. Capable of handling boards up to 229 x 254 mm with a placement accuracy to 0,025 mm and interconnection pitches as low as 0,3 mm, the APR-5000 Array Package Rework System is ideal for reworking smaller PCBs such as cellphones and laptop computers.
Metcal has designed the APR-5000 Array Package Rework System for the long term, with the ability to pre-heat boards uniformly even with lead-free solders, and deliver the higher solder melt temperatures necessary to rework lead-free assemblies that is soon to become mandatory.
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