No clean lead-free solder paste

2 June 2004 Manufacturing / Production Technology, Hardware & Services

W.C. Heraeus' Circuit Materials Division has introduced newly developed lead-free no-clean solder paste. The F 620 Series is claimed to have outstanding wetting capability, suited for a variety of commonly used industry profiles and can be soldered in both air and nitrogen, on surfaces with NiAu, immersion Sn, Cu OSP and alternative surfaces.

F 620 shows no tendency to hot slump and features superior print after wait properties. A major benefit is the high tack of the paste. The rheology of the paste is optimised to allow high printing performance with narrow stencil openings. It also has a very high SIR, with no migration or dendritic growth after storage in harsh conditions, and no beading/mid-chip balls are additional benefits.

The Solder Flux of this Paste passes the generally applied surface insulation resistance tests, even under harsh conditions such as in the automotive industry: 85°C/85%rh, 21 days, measurement with 100 V d.c. During in-circuit tests, the test probes can easily penetrate the flux residues and only very clear residues remain, even after several contacts.

For more information contact E.I.S., 011 726 6758, [email protected]

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