160 mm robust box
25 October 2000
Manufacturing / Production Technology, Hardware & Services
The Robust-Box series from OKW is now widely used in many fields of electrical engineering and electronics because of its dual system. Top and base part are largely identical in their design. In this way, the user can decide for himself if he wants to apply the flat or the high case part as bottom. A flat base part, for example, allows easy repair and service. A high base part is suitable for the application of bigger cable profiles with the corresponding screw fittings. The secure connection of top and base part is performed by special screws with preshaped threads. Due to a continuous groove and tongue connection with sealing the high protection Class IP 65 can be achieved.
Customers' demand resulted in a range of larger dimensions. The new sizes of cases are 200 x 300 mm and 240 x 360 mm with the heights 80, 120 and 160 mm. The assembly of these dimensions is performed with six screws, also to IP 65 protection. The interior of the large cases offers many fixing possibilities for mounting plates and up to two DIN-rails. The height of 160 mm thus allows the accommodation of voluminous DIN-rail cases or devices.
The existing 160 x 240 mm type is now also available in a height of 120 mm.
A special accessory of the Robust-Box are the coloured cover strips. They can be used for coding, eg cases for installation can be coded with blue cover strip for ventilation and with a red one for heating. The user can choose from the colours light grey, silver grey, red, yellow, green and blue.
Further reading:
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...
printer friendly version