Licensing agreement to develop GbX cable assemblies
11 August 2004
Interconnection
Infrastructure
Molex has announced it has signed a new licensing agreement with the Connection Systems Division (TCS) of Teradyne, an industry leader in high-performance connection systems. Under the agreement, Molex will develop and manufacture cable assembly solutions for Teradyne's GbX interconnect platform.
"Developing innovative interconnection devices for the global marketplace is a top priority for Molex. One way we accomplish this goal is by consistently and aggressively reinvesting in product and technology research and development each year," said Michael Miskin, business unit manager, High Performance Cable Group, Molex Incorporated. "By creating these GbX cable assemblies, our customers will be able to meet ever-increasing speed requirements, save board space and still lower their applied costs."
In January 2003, Molex signed a second-source licensing agreement, granting the rights to patents, trademarks and technology to make and sell Teradyne's GbX product family worldwide. Under the new agreement, Molex has further extended its capabilities to develop cable assemblies for the GbX product family.
"By manufacturing the new cabling solutions for Teradyne's GbX interconnect platform, Molex continues to strengthen our successful partnership that began in 1996. Since then, both companies have worked closely to market products that share a design, not just a specification," said Lou Zajac, marketing manager for Teradyne Connection Systems. "When the cabling solutions are available, original equipment manufacturer (OEM) users can source all GbX interconnect components with confidence that the parts will work together and meet their performance and reliability requirements."
Molex's latest GbX connector system was unveiled at Supercomm 2004 in June. The connector system is well-suited for low risk, high performance backplane interconnect delivers speeds from 6 to 10 Gbps while providing high-density with up to 27 real differential pairs per 10 mm for leading-edge backplane applications. With its ability to route in two directions and robust mechanical design, says the company, it lowers system costs by eliminating PC-board layers and the need for extra, protective mechanical hardware.
For more information see www.molex.com/product/backplan/gbx.html
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