BGA sockets feature MPI material system
11 August 2004
Interconnection
Products & Solutions
Tyco Electronics' MPI (metallised particle interconnect) polymer system provides a highly conductive interconnect. This proprietary material consists of a high temperature polymer compound that has been embedded with metalised particles.
The material is formed into micro-columns just 0,635 mm in diameter and less than 1 mm high. The columns are held in a grid pattern by a thin polyimide substrate. When mechanically compressed, the columns' electrical characteristics are optimised.
The unique design of the BGA socket uses an anti-overstress feature that protects the contact and also provides a well for the ball to rest in. This well acts as an alignment feature that centres the BGA ball to the MPI polymer material. Corner frames provide for gross alignment of the package to the socket.
Figure 1. Contact to solder ball interface
The MPI socket provides a compression mount solderless interconnect. A hardware system is required to generate the necessary forces. Tyco Electronics offers a complete hardware solution for each socket size. Each hardware kit contains enough hardware for one socket - a spring plate, a top plate, and a bolster plate with insulator.
Figure 2. The MPI socket provides a compression mount solderless interconnect. A hardware solution generates the necessary forces. Each kit contains a spring plate, a top plate, and a bolster plate with insulator
Key electrical specifications include 4 A per column maximum and a contact resistance of 50 mΩ maximum. Insulation resistance is 1000 MΩ at 100 V d.c., and the capacitance rating is 0,1 pF. Standard operating temperature range is 0 to 90°C, and the compression force is 70 g/contact (nominal). Available in standard pitches of 1,27, 1 and 0,8 mm, the sockets accept standard Jedec solder ball sizes.
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