Computer/Embedded Technology


3G prototyping and high-speed data acquisition development platform

22 September 2004 Computer/Embedded Technology

Sundance's advanced signal processing and wireless technologies research and engineering group has revealed a cutting-edge development and experimental platform for the wireless and telecommunication markets. The SMT8090 is the result of the company's strong R&D heritage and multidisciplinary engineering group. It provides telecommunication designers with a highly integrated solution blending state-of-the-art digital signal processing (DSP) processors, FPGA, and high throughput converters in a single, compact, and integrated environment.

Comments Dr Nory Nakhaee, CEO of Sundance: "With the SMT 8090, Sundance is providing wireless and telecommunication system developers a pre-production prototype system platform that gives a unique cost cutting advantage. It helps reduce their development and time window by allowing them to immediately and rapidly test their 3G wireless designs without fumbling through long learning curves."

The SMT8090 is an integration feat where two daughter-cards (SMT338-VP and SMT390) are sandwiched together on a carrier board that ensures PCI connectivity. For signal, and reconfigurable processing, the system integrates two Texas Instruments floating-point 225 MHz TMS320C6713 processors harmonised in a well-balanced architecture with a powerful Xilinx Virtex-II Pro FPGA that integrates two 400 MHz IBM PowerPC processors, and eight 3,125 Gbps full duplex serial transceivers.

Supported by 256 MB of SDRAM for the TI DSP and 128 MB for the Xilinx FPGA, the SMT8090 sports an 8 MB Flash ROM for boot code FPGA configuration and 'standalone' application, while I/O are articulated around two high-speed and high bandwidth Sundance high-speed buses (SHB). Leveraging LVDS signals built into the Virtex-II Pro FPGA, Sundance's R&D engineering developed a novel interface approach that separates control functions from noise-sensitive digital acquisition semiconductors. Two 12-bit, high speed ADCs sampling up to 210 MHz are integrated on the daughterboards, and are optimised for dynamic performance in wide and broadband systems.

The SMT8090 was designed to meet the needs of OEMs who require a long-lasting, flexible, and well integrated development platform to be used in a variety of embedded communication applications. Sundance says it has carefully chosen the processing components and architecture, ensuring that OEMs can cost-effectively leverage the SMT8090 flexibility in more than one implementation.

For more information contact Hendri Veldman, Sundance Multiprocessor Technology, 0944 1494 793194, [email protected]





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Intelligent video processing
Rugged Interconnect Technologies Computer/Embedded Technology
The CHARM150AGX is based on a NVIDIA AGX Orin embedded processor, which incorporates a multicore ARM processor and powerful AI/ML accelerator.

Read more...
Quectel’s single-board computers put industrial edge computing on one PCB
iCorp Technologies Computer/Embedded Technology
Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial applications, include three compact development platforms – the Quectel Pi M1, L1, and H1 boards.

Read more...
Nordic expands nRF Cloud with firmware vulnerability scanning
RF Design Computer/Embedded Technology
nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.

Read more...
Arrival of the Epic-PTH9
Vepac Electronics Computer/Embedded Technology
AAEON introduces the EPIC-PTH9, a compact 4-inch industrial single-board computer powered by Intel Core Ultra Series 3 (formerly Panther Lake) processors.

Read more...
EPS-9600 Managed Layer 3 Ethernet Switch with next-generation Time- Sensitive Networking
Electronic Products Design Computer/Embedded Technology
Diamond Systems has introduced EPS-9610 (part of the EPS-9600 family), a rugged, ultra-compact embedded Ethernet switch which integrates military-grade ruggedness with next-generation Time-Sensitive Networking (TSN) capabilities.

Read more...
An industry-first Android 16 smart module solution
RF Design Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.

Read more...
Accelerate STM32-based IoT development with SPI EEPROM board
Altron Arrow Computer/Embedded Technology
ST Microelectronics’ ready-to-use STM32 expansion board helps design more efficient battery-friendly IoT devices based on ultra low power 32-Mbit Page.

Read more...
Unleash the next generation of Intel Core power
Vepac Electronics Computer/Embedded Technology
The EPIC-BTS9 from AAEON, is tailor-made to bring unprecedented performance to smart manufacturing and industrial robotics.

Read more...
QMC series I/O modules for VITA 93 small form factor mezzanine
Rugged Interconnect Technologies Computer/Embedded Technology
The new line of VITA 93 QMC mezzanine modules, from Acromag, are engineered to meet increasing demands for smaller form factors and more performance.

Read more...
MIKROE celebrates 2000th Click board
Computer/Embedded Technology
MIKROE has launched its 2000th Click board, the RTC 27 Click, designed for low-power real-time clock and calendar functionality, time tracking, alarm event generation, watchdog timing, and timestamp capture.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved