Schottky rectifier in new flat lead package

20 October 2004 Power Electronics / Power Management

Royal Philips Electronics' portfolio of MEGA Schottky rectifier diodes now includes the compact flat lead SOD323F package. These rectifiers are more than 75% smaller than rectifiers in the industry standard SMA package and 60% more efficient than Philips' MEGA Schottky rectifiers in the SOD323 package. These rectifiers are intended for use in power management applications to improve performance, extend battery life and to reduce board space needed in products such as mobile phones and digital cameras.

Power dissipation due to forward voltage drop has remained a major limitation in improving overall electrical efficiency and reducing package sizes. The heat generated has caused package sizes to remain significantly larger than the silicon die to conduct heat away from the die to prevent damage. Philips' new compact SOD323F flat lead package has a shorter thermal pathway than the SOD323 gullwing package and uses thicker lead frame material to significantly lower the thermal resistance of the package. As a result, Philips says the MEGA Schottky rectifiers in the SOD323F have a 50% higher current capability and operate at higher temperatures than other Schottky rectifiers.

The SOD323F is a compact 1,7 x 1,25 x 0,7 mm.

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