Cyan Technology's configurable low power microcontroller, the eCOG1, has been chosen to be at the heart of the communications controller module in a new powerful wireless communications system developed by PIC now being trialled by the BBC and other partners in the 'SWORD project.'
PIC is at an advanced stage in the development of its 'state-of-the-art' wireless system, known as a Universal Wireless Node, which can seamlessly interface a broad range and large number of sensors - analog, digital or visual - and data devices to a variety of wireless modems. Optional wireless interfaces include GSM, GPRS, WiFi and satellite communications with data rates ranging from 9,6 Kbps to 52 Mbps. This makes the system suitable for a wide range of still image, video and data transmission applications right up to broadcast quality.
The eCOG1 handles the management of the various communications interfaces. A comprehensive suite of software modules has been developed for the system designed to provide a choice of speed and type of point-to-point communications or full Internet access via PC, laptop, PDA or mobile phone.
According to PIC's Andrew Maidment, in addition to the hardware features of the eCOG1, the Cyan development environment was important to the success of the project. "We needed to be able to develop a variety of modules to support all our different interface options," he says. "The CyanIDE software tools enabled us to easily reconfigure the peripherals in the controller, and to develop the appropriate software very speedily."
Early customers for the PIC system include household names such as the BBC which uses PIC's technology for transmitting pictures (such as that from Blackpool Tower in the UK) directly to their website for public viewing. The system is also being used for traffic monitoring and status reporting from billboard sites.
The system being developed is currently known as SWORD and is funded by the British National Space Corporation (BNSC) - an offshoot of the Dti. The project group developing the project includes specialist UK organisations, SciSys and SICL. Several businesses are keeping closely in touch with the Project Group to ensure ready uptake of the technology in the marketplace with project partners now actively involved in system trials.
For more information contact MB Silicon Systems, +27 (0)11 728 4757, [email protected]
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.