The complexity of electronic components increases every day. This results in ever higher cooling requirements. Seifert Electronic now offers an optimum solution that enables the design engineer to realise numerous hardware configurations.
The new 'Vario' fin series is a technical innovation especially suited for applications with high thermal loads where efficient cooling is a must. The system enables much closer fin distances than can be achieved with conventional pressing techniques for aluminium sections. This results in greater cooling surfaces and lower unit weights.
With this novel technical solution, the heatsink base and fins form an integral unit. It is now the client who can decide about the module. The modular construction principle enables a multitude of different application and performance needs to be satisfied. Another advantage is that tooling expenses can be significantly reduced.
The base thickness ranges between 7 and 20 mm with fin heights up to 125 mm.
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