Less space required for the same level of contact density - this is what distinguishes the double-level base housing of Phoenix Contact's Mini- and Micro-Combicon series. The performance spectrum has been broadened by the new high-temperature models MCD(V) 0.5-HT and MCD(V) 1.5-HT. They are suitable for use in the pin-in-paste process and can be reflow soldered. This enables simultaneous processing with SMD components, similar to the advantages of THR technology. Secondary processes such as wave soldering are no longer necessary.
Both series of components are available in either horizontal or vertical design with two to 12 pins. The straight front on the double-level base housing makes for a flush fit in housing cutouts.
For more information contact Electrocomp, +27 (0)11 458 9000, or Sean Hadley, Phoenix Contact, +27 (0)11 793 7121, [email protected]
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