Thermal management gap filler pads

23 February 2005 Power Electronics / Power Management

FerriShield's thermal gap filler pads are high heat transfer media that conform to surface irregularities and adhere to a wide range of shapes and sizes of components; in particular, recessed areas and protrusions.

Four grades, each with a cost-effective formulation suitable for the thermal conductivity needed on a given application, accommodate demanding situations. Convenient sheet configurations are suitable for die-cutting or easy hand-slitting operations.

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