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Electronics Buyers' Guide

Electronics Manufacturing & Production Handbook 2019


 

Flexible high density power interconnects
9 March 2005, Interconnection

Samtec offers a high density, power-to-board interconnect system on 2 mm pitch (TPCM/TPCF series) that can be used for elevated board stacking. These four-row interconnects can carry 27 A at 80°C over four banks of four power pins each. An eight-bank system is currently being tested for power-rating. Power banks are separated from the nearest signal pins by 3,5 mm to maximise the power capacity.

For board stacking applications, the board spacing with standard connectors can range from 10 mm to 20 mm. End shrouds assure proper mating in blind applications, and Tiger Buy tuning fork style phosphor bronze contacts provide high retention.

Samtec has a broad line of power interfaces for board-to-board and discrete wire-to-board applications. Discrete wire connectors are available on 4,19 mm pitch (IPBD Series) and 2,54 mm pitch (IPL1 Series) and headers and sockets (IPBT/IPBS and IPT1/IPS1 series) are available for vertical board stacking and perpendicular applications.

A large variety of other power combination power/signal interfaces are also available.


Credit(s)
Supplied By: Electrocomp
Tel: +27 11 458 9000
Fax: +27 11 458 9034/5
Email: andrew@electrocomp.co.za
www: www.electrocomp.co.za
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