Interconnection


Dual-row density automotive connectors

9 March 2005 Interconnection

Automotive connectors face the toughest environments, most demanding standards, tightest tolerances and smallest margins for error. Given that benchmark, Molex re-introduced its H-DAC 64 family of 0,64 mm width interconnect products. With automotive electrical applications increasing constantly, and space for them decreasing. Available in six through 20 circuits, plus a 24-way hybrid, the H-DAC 64 product line includes vertical and right angle headers, wire-to-wire and wire-to-board receptacles and wire-to-wire connectors.

Originally developed to accommodate various radio applications, these connectors are finding their way into lighting controls, navigation systems and many other controller applications where durability, reliability and flexibility are critical.

The header housings incorporate alignment pegs that secure the header to the PCB until it is permanently soldered, ensuring correct placement. The receptacle housing contains flexible lock fingers with a terminal position reassurance (TPA) feature. Together, these enable superior terminal retention inside the receptacle. Both the receptacle and headers feature scoop-proof housings that protect against accidental bending of pins, making assembly easier.

A positive latching system provides maximum mating security in high vibration applications. Housings may be moulded in three polarisation configurations, providing flexibility and security in mating options. It is rated for 250 V, 7 A.



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