Local Universal Instruments' representative, Zetech, has announced that the company has added seven new white papers to its global website, www.uic.com, and enhanced the site's dedicated white paper section with two new subject areas: Thermal Management and Medical Electronics.
The new white papers are:
* Effects of assembly process variables on voiding at a thermal interface.
* Quality and reliability considerations for the assembly of implantable medical electronics.
* Low force placement solutions for delicate and low I/O flip chip assemblies.
* Fragility of Pb-free solder joints.
* Lead-free and tin-lead assembly and reliability of fine pitch wafer level CSPs.
* Study of alternate surface finishes of quad flat packs.
* Assembly and reliability issues associated with leadless chip scale packages.
Universal's website has a dedicated section incorporating almost 60 different industry white papers, covering topics ranging from 0201 assembly, optoelectronics, adhesive and dispensing, to no-lead soldering. The white papers are based on the research and development work done at its SMT Laboratory in Binghamton, USA, and the Technology Excellence Center in Suzhou, China, which focuses on optimising current manufacturing processes, and identifying and advancing the new and emerging technologies in electronics assembly.
Rooibos heads to space
News
A South African scientific initiative linking agriculture and space research has officially launched today with the Rooibos in Space programme at Parklands College’s Innovation Centre in Cape Town.
Read more...Engineering trust in South Africa’s SMT sector ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
From a small Johannesburg start-up to a trusted SMT technology partner, Zetech One has spent four decades helping South African electronics manufacturers improve production quality, efficiency and reliability.
Read more...From the editor's desk: Local can be international Technews Publishing
Editor's Choice News
Welcome to the July 2026 issue of Dataweek. As you can see from this introduction, Dataweek’s regular editor, Peter Howells, is on extended leave and I am filling the void in his editor’s column – hopefully without being too boring.
Read more...Landis+Gyr EMEA introduces new company name: EYKON
News
EYKON is the new company name of Landis+Gyr EMEA, formerly part of the Landis+Gyr Group. The company supports electricity, gas, water and thermal utilities in managing increasingly complex networks, improving operational efficiency and enabling more sustainable use of resources.
Read more...Etion Create invests in a Smart Storage Management Solution ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
Zetech One recently supplied and installed an Essegi Automation smart storage management solution, the Uniflex Series and Auto Incoming station, at Etion Create’s facility in Irene, Pretoria.
Read more...Yamaha Robotics will show visitors to EFX
Manufacturing / Production Technology, Hardware & Services News
Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from 6-8 October 2026, how advanced surface-mount automation helps companies grow their business and increase productivity.
Read more...TSE has relocated
News
The Technology Station in Electronics (TSE) has entered a new chapter with its relocation from the CSIR campus to TUT-owned building at Ditsela Place in Hatfield.
Read more...Innovative MyLegrand app RS South Africa
News
Legrand SA is set to launch the MyLegrand mobile application, a digital platform designed to strengthen engagement across its professional network.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version