Local Universal Instruments' representative, Zetech, has announced that the company has added seven new white papers to its global website, www.uic.com, and enhanced the site's dedicated white paper section with two new subject areas: Thermal Management and Medical Electronics.
The new white papers are:
* Effects of assembly process variables on voiding at a thermal interface.
* Quality and reliability considerations for the assembly of implantable medical electronics.
* Low force placement solutions for delicate and low I/O flip chip assemblies.
* Fragility of Pb-free solder joints.
* Lead-free and tin-lead assembly and reliability of fine pitch wafer level CSPs.
* Study of alternate surface finishes of quad flat packs.
* Assembly and reliability issues associated with leadless chip scale packages.
Universal's website has a dedicated section incorporating almost 60 different industry white papers, covering topics ranging from 0201 assembly, optoelectronics, adhesive and dispensing, to no-lead soldering. The white papers are based on the research and development work done at its SMT Laboratory in Binghamton, USA, and the Technology Excellence Center in Suzhou, China, which focuses on optimising current manufacturing processes, and identifying and advancing the new and emerging technologies in electronics assembly.
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