New silicone gel for automotive electronics market

6 April 2005 Manufacturing / Production Technology, Hardware & Services

Dow Corning has introduced a new thixotropic dielectric silicone gel to protect sensitive electronic devices used in the automotive market. The new EG-3000 silicone gel is designed to meet the needs of automotive electronics manufacturers who are adopting hybrid circuit designs that must be sealed and protected from harsh, under-the-hood conditions.

The gel's hybrid LTCC (low-temperature co-fired ceramic) based technology offers two key advantages: enabling circuit modules to be made smaller and lighter as well as allowing multiple layers of circuitry to be stacked upon each other, thereby achieving higher densities than traditional PC board modules.

Significant cost savings are presented by EG-3000's ability to fully encapsulate individual components without having to cover the entire electronics module housing. By using this gel, material consumption can be reduced by 30-40% per module, it claims.

Its properties make it suited for coating, encapsulating and potting automotive electronic components, such as hybrid circuit devices with very fine wire bonds. The low-volatility material is compatible with automated dispensing equipment.

For more information contact Don Piering, Dow Corning, [email protected]

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