Amphenol's Mini-Box connectors includes an extensive range of board-to-board; board-to-wire; wire-to-wire and board-in connector systems. Available from 0,5 to 2,54 mm pitches, these low powered (up to 3 A) economical connectors were developed with high density contact with low insertion/extraction forces, and reliability in mind. They are available from one to 120 positions, in SIL, DIL and TIL formats.
Variations available include SMT or through hole solder types; IDC or crimp cable terminations; for ribbon or for discrete wire; top, side or bottom through board contact; straight or right angle headers, shrouded or unshrouded; one or two piece solutions; polarised/latching.
These connector systems are compatible with many of the major connector manufacturer's products.
Thinner pattern coils set to revolutionise wireless charging Electrocomp
Power Electronics / Power Management
TDK developed the 0,76 mm thick charging coils using a unique pattern coil technology without employing conventional lithographic exposure and etching techniques.
Read more...RF cavity filters for 5G Electrocomp
Telecoms, Datacoms, Wireless, IoT
Temwell has established a one-stop service for 5G RF cavity filters, featuring high specifications across a wide range of power requirements.
Read more...Multilayer ferrite beads Electrocomp
Passive Components
As direct replacements for the discontinued BMB series, TE Connectivity’s BMC multilayer ferrite beads cover a wide range of impedance characteristics.
Read more...Wire-to-board connectors with 0,8 mm pitch Electrocomp
Interconnection
An extensive array of circuit sizes (2 to 20 circuits) enables the extension of device functionality and features to meet product development needs.
Read more...Regional edition of Degson catalogue Electrocomp
Technical Literature
Electrocomp has released a special regional edition of Degson’s short-form general catalogue. The 8-page catalogue summarises Degson’s range of PCB terminal blocks, DIN-rail terminal blocks, heavy-duty ...
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