Thermal conduction pads are also electrically insulated

15 June 2005 Manufacturing / Production Technology, Hardware & Services

The T-gon CP200 and CP230 mid-grade thermally conductive insulator pads can be used in a wide variety of electronic applications to enhance heat transfer - and, therefore, promote cooling. From Thermagon, a unit of Laird Technologies, the pads eliminate air gaps between hot components such as power semiconductors, and heat sinks or housings.

Being relatively soft the pads are designed to conform to the contours of the two surfaces, thus reducing the thermal resistance between the components. In this way, heat transfer is greatly increased, and the life of the electronic component is extended. The T-gon pads not only help keep components cool; they can also provide electrical insulation up to 5500 V if required.

T-gon CP200 is 0,200 mm thick, while T-gon CP230 is 0,230 mm thick. Both are made from glass-fibre covered with a ceramic powder filled silicone, a design providing a number of benefits - high thermal conductivity, superior dielectric strength, high chemical resistance and a wide temperature operating range (-60 to 180°C).

Specific applications for these UL 94 V0 rated products include power semiconductors (TO packages, MOSFETS, IGBTs etc), power conversion equipment, audio and video components, automotive control components, motor controllers/drives, general high pressure interfaces, etc, T-gon is also available in 300 x 300 mm sheets.

For more information contact Connecta, +27 (0)463 2240.

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