Manufacturing / Production Technology, Hardware & Services


Tiny MicroPak packaging for logic devices

15 June 2005 Manufacturing / Production Technology, Hardware & Services

Philips has advanced state-of-the-art packaging with the MicroPak. Designed for use in portable applications, where board space is always an issue, these packages are dramatically smaller - 65% smaller than the company's smallest PicoGate packages - but maintain the industry-standard 0,5 mm pad pitch. The MicroPak package (1,0 x 1,5 x 0,5 mm) can also be used as an alternative to the wafer-level chip scale package (WCSP), providing more reliable and rugged performance in the same amount of space because MicroPak devices have 40% larger pad area than those of a WCSP device. The Philips MicroPak package evolved from the Philips micro carrier device (MCD), a discrete MOS leadless package built using a quad flat nonleaded technology. MCD is the world's smallest package for single diodes and transistors and improves RF performance by reducing the parasitic capacitances between the die and its package. This technology is now available in Philips' HC/T and LVC logic families.



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