Today is an 'Embedded World' where computers are ubiquitous. Most standard embedded single-board-computers (SBC) cannot 100% meet application specifications because they do not have the flexible interfaces to develop and expand the system.
Advantech thus introduced its module I/O (MIO) interface concept. The MIO interface is an open-pin definition MIO specification designed to be both fast and flexible. It integrates the most popular interface signals together into a high-density 160-pin connector. These interfaces include PCI bus: 32-bit PCI compliant, high-speed USB 2.0, digital video output (DVO), low pin count (LPC), and AC97 audio codec. The MIO interface is designed to speed up system project design and save cost.
The open-source MIO interface is incorporated into the MIO module series, a series of add-on cards that stack and fit into the smallest enclosures. They are designed to align with the SBC connector outline, thereby making system expansion and integration easier.
Some standard Advantech MIO products include:
MIO-250: 3 Fast Ethernet MIO - three Realtek RTL8139DL 10/100BaseT Ethernet controllers; three RJ45 connectors; LAN bypass supported on LAN2 and LAN3.
MIO-252: PC/104 to MIO - module I/O interface to PC104 (PCI + ISA with LPC) expansion.
MIO-253: 5 COMs MIO - four RS232/422/485 ports; two RS232 ports; five DB-9 connectors; one 5 pin - 2 pin headers.
MIO-254: multimedia MIO - Dual 6 W stereo AC97 audio, support Spk_out, Line_In, Mic_In; S-Video; C-Video; DVI.
Rugged, I/O-rich NVIDIA Jetson solutions Electronic Products Design
Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.
Read more...New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.
Read more...Smallest 13th gen Intel SBC Vepac Electronics
Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.
Read more...Versatile PoE extender Vepac Electronics
Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...QuecPi smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
Read more...Eskom announces PV registration extension
Computer/Embedded Technology
The South African Photovoltaic Industry Association has welcomed Eskom’s decision to extend its zero-registration fee policy and free smart meter installation for residential Small-Scale Embedded Generation customers until March 2026.
Read more...Unlock enhanced wireless performance
Computer/Embedded Technology
Duxbury Networking has introduced Cambium Networks’ Deep Virtual Circuit (Deep VC) technology, a free upgrade for the PMP 450 platform that will transform wireless broadband performance across the country.
Read more...Computing in industrial environments Vepac Electronics
Computer/Embedded Technology
The Panasonic Toughbook CF-33/CF33 Tablet is a 12,0-inch fully rugged device with hot-swappable twin batteries and highly configurable capabilities.
Read more...DDR5 DRAM series Vepac Electronics
Computer/Embedded Technology
Innodisk has announced its DDR5 6400 DRAM series featuring the industry’s largest 64GB single-module capacity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version