Semi-automatic stencil printer with vision system for quick board alignment
27 July 2005Manufacturing / Production Technology, Hardware & Services
Surveillance
News & Events
The requirement for using lead-free solder paste has pointed most people's attention to the fact that higher soldering temperatures are needed. However, there is another challenge, and that is, printing accuracy because of poor wetting behaviour of lead-free solder pastes.
Flexibility and accuracy were key for Dima when designing its latest semi-automatic stencil printer, the HS-100. The heart of the machine has a rigid casting where the motor-driven printing head is guided over the frame with linear bearings.
All parameters like printing speed, squeegee pressure, lift off speed, printing stroke and maintenance parameters can be programmed using the Dima-soft Windows-based user interface, offering optimum settings for every individual PCB. Once the system knows the correct position of the board it will alarm the operator when the board position is not within the preset tolerance. The maximum tolerance level between the board and the stencil is programmable between 1 and 100 microns.
The PC-controlled HS-100 is equipped with a 15" TFT monitor and two CCD cameras for a clear view on the process and accurate board alignment, a scaled PCB table for repeatable board placement with a high mix of boards, a Mylar foil for test printing and board alignment and magnetic locating pins, board supports and software controlled vacuum units for easy board placement. Optional features are a squeegee starter set, a puck pack adapter and under stencil cleaning unit.
The HS-100 allows stencil frames up to 58,4 x 58,4 cm; the maximum print area is 450 x 400 mm; machine accuracy is ±25 μm @ 3 sigma while the repeatability is ±10 μm @ 3 sigma, enabling printing for components with a pitch of 0,3 mm.
For more information contact MyKay Tronics, +27 (0)11 902 6820.
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