24 August 2005Manufacturing / Production Technology, Hardware & Services
Cooling aggregates are very useful for the dissipation of significant quantities of heat produced in small spaces. This is due to the strong air flow that removes significantly more heat per unit volume than in the case of free convection. Fischer Elektronik has developed small-sized cooling aggregates with a cross section of 30 x 30 or 40 x 40 mm in order to meet the demand for small-volume cooling aggregates.
The company's cooling aggregates of the LAM product line are suitable for installation in cases and in PCBs etc. The compact design with internal heat exchange structure enables homogeneous heat dissipation. The strong axial fan motor with 12 or 24 V d.c. features a high air throughput at high pressure, so that even longer cooling distances can be bridged.
Threaded drill holes for fitting components or for fastening can be provided on all surfaces. In addition to the existing standard range of products, modified products and special versions according to customer's specifications are available.
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[Sponsored] As South Africa positions itself as a fast-growing player in global electronics manufacturing, an often overlooked yet critical phase in the production lifecycle is coming into focus: device programming.
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