7 September 2005Manufacturing / Production Technology, Hardware & Services
Access Control & Identity Management
To dissipate heat in enclosures that have high safety classes, Rittal offers an innovative cooling solution for the power electronics - in particular, for cases where conventional cooling methods cannot be used.
With Rittal's direct cooling package (DCP), components such as variable-frequency converters, servo-controllers, motor-controllers, braking resistors, line filters, and motor choke inductors can be efficiently cooled through a liquid-operated partial assembly mounting plate.
The Cold Plate system may be installed as an attachment system consisting of T-slots and clamp straps. Additional drilling on the cooling plate is thus not necessary. Alternatively, Cold Plate is available with a completely free surface for customer-made tapping. This allows flexible installation of varying components. Both variants are available with various coolant infrastructures, either with standard enclosure piping or with stainless steel distributor and flex-piping.
Centurion raises the bar at HomeSec Expo Centurion Systems
News & Events Access Control & Identity Management Residential Estate (Industry) Smart Home Automation Commercial (Industry)
Centurion Systems unveiled its latest product lines at HomeSec Expo 2026, introducing SMART+, a simpler way for installers and end users to manage their Centurion installations - as well as a few new products.
Read more...Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...Access trends for 2026 Technews Publishing SMART Security Solutions RR Electronic Security Solutions Enkulu Technologies IDEMIA neaMetrics
Editor's Choice Access Control & Identity Management Infrastructure
The access control and identity management industry has been the cornerstone of organisations of all sizes for decades. SMART Security Solutions asked local integrators and distributors about the primary trends in the access and identity market for 2026.
Read more...Access data for business efficiency Continuum Identity
Editor's Choice Access Control & Identity Management AI & Data Analytics Facilities & Building Management
In all organisations, access systems are paramount to securing people, data, places, goods, and resources. Today, hybrid systems deliver significant added value to users at a much lower cost.
Read more...Beyond the fence Technews Publishing Fang Fences & Guards SMART Security Solutions
Perimeter Security, Alarms & Intruder Detection Access Control & Identity Management
In a threat landscape characterised by sophisticated syndicates, harsh environmental conditions, and unstable power grids, a static barrier is no longer a defence; it is merely a brief delay.
Read more...Zero Trust access control Technews Publishing SMART Security Solutions CASA Software NEC XON
Editor's Choice Access Control & Identity Management Information Security
Zero Trust Architecture enforces the rule of ‘never trust, always verify’. It changes an organisation’s security posture by assuming that threats exist both inside and outside the perimeter, and it applies to information and physical security.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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