DSP, Micros & Memory


DSP platform to enable next generation digital video and audio

5 October 2005 DSP, Micros & Memory

During a global event last month, Rich Templeton, president and CEO of Texas Instruments, introduced DaVinci, calling it the 'world's most advanced semiconductor technology for next generations of digital video products.' DaVinci is a DSP-based solution tailored for digital video applications that provides video equipment manufacturers with integrated processors, software and tools to simplify the design process and accelerate innovation.

Much like what TI has done for its wireless mobile phone customers, says TI, DaVinci (www.thedavincieffect.com) will allow digital video designers to choose a signal processor tailored for their needs and then select from a menu of production ready software, reducing time to market and increasing innovation by an order of magnitude. For consumers, these advancements will result in new generations of digital video products that go far beyond today's capabilities. TI gives the example of consumers no longer having to correct colour and lighting problems on a digital photo using their PC - those corrections will be done automatically by the camera. Also, instead of multiple systems, one TV set-top box will allow consumers to play and/or record, as well as video conference with friends simultaneously. Taking this technology one step further, consumers with a video security system will be able to identify a visitor at the front door, unlock it and open it via their TV remote.

TI expects to announce DaVinci-based processor samples, software and development tools by year-end 2005. DaVinci-enabled solutions are in the pipeline for products such as digital cameras, automotive infotainment products, portable media players, set-top boxes and video security systems.

"This is premier digital signal processing technology that will grow the market for new digital video applications and make existing applications much easier to use," stated Templeton. "TI is continuing its promise to accelerate the pace of innovation for the communications and entertainment era."





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

1 GHz crossover MCU with Arm Cortex Cores
Future Electronics DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.

Read more...
NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.

Read more...
UFS 5.0 flash for on-device AI
EBV Electrolink DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.

Read more...
Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved