Intersil has developed a new exposed paddle or E-pad MOSFET package that enables power supplies to run cooler and more efficiently. Available in a thermally-enhanced 8-lead small outline integrated circuit (SOIC) and designed specifically for Intersil's recently released family of high-frequency, dual n-channel power MOSFET drivers, the E-Pad features a copper pad connection to the PCB ground that acts as a heatsink. According to Intersil, transferring heat from the MOSFET driver IC through the copper pad reduces thermal resistance by up to 50% and enables the MOSFET driver to operate cooler and more efficiently.
The HIP6601 and HIP6603 dual n-channel MOSFET driver ICs are Intersil's first Power Management products offered in the E-pad package. The HIP6601MCP, along with Intersil's HIP630X multiphase pulse-width modulator (PWM) IC family, has been designed into leading workstation motherboard platforms featuring AMD's Athlon microprocessors.
E-pad packaging was developed to address the market demand for increased power dissipation in a limited motherboard area. It significantly improves the performance and reliability of nonisolated, step-down DC-DC converters including discrete voltage-regulator-modules (VRMs) or embedded power supplies.
The E-pad also eliminates the need for added heatsinks and more expensive MOSFETs featuring low on-resistance.
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