CSP Schottky diodes shrink footprints by 70%

Power Electronics / Power Management

19 October 2005 Power Electronics / Power Management

International Rectifier has introduced four new FlipKY Schottky diodes that it claims are smaller and more efficient than typical industry-standard Schottky devices. Offered in chip-scale packages (CSP), these new 0,5 A and 1,0 A devices are intended for handheld, portable equipment where space is crucial. Applications include current steering, ORing, boost and free-wheeling circuits.

The 30 V IR0530CSP and 40 V IR05H40CSP are 0,5 A devices housed in a compact three-bump, CSP that occupies only 1,1 mm² of board space with a profile of less than 0,6 mm. Compared to industry-standard SOD-123-packaged Schottkys, these devices occupy 80% less board space and operate up to 40% cooler.

IR's 30 V IR130CSP and 40 V IR1H40CSP are 1 A BGA devices, occupying only 2,3 mm² of board space - about one third the area consumed by a JEDEC DO-216AA package, yet deliver similar electrical and thermal performance.

FlipKY chip-scale packaging technology eliminates the lead frame, epoxy and mould compound traditionally used in other device packages and provides all electrical connections on one side of the silicon. This design not only minimises board space and device profile, but also reduces parasitic inductance. In high frequency switching applications, less parasitic inductance reduces voltage spikes and switching noise. The large bumps also serve as efficient heat conduction paths. This packaging technology also enables the parts to be assembled with standard SMT techniques.

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CSP Schottky diodes shrink footprints by 70%

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