16 November 2005Manufacturing / Production Technology, Hardware & Services
The high heat losses associated with ATCA boards of up to 200 W per slot and up to 3,2 kW with fully-populated shelves necessitate powerful, flexible cooling strategies. With the LCP Liquid Cooling Package, Rittal offers targeted cooling from the side panel of the rack. Individual ATCA shelves, as well as fully-configured enclosures, can be cooled according to output.
Up to a maximum of three air/water heat exchangers each with a cooling output of 4 kW as standard and a volumetric airflow of 800 m³ per hour may be housed in the LCP - with retrospective upgrades supported at any time. At maximum configuration, this translates into a cooling output of 12 kW and a volumetric airflow of 2400 m³. Optionally, a cooling output of up to 20 kW can be achieved. The climate control modules draw in cold air directly in front of each computer's level - precisely where the heat is generated - and in this way, ensure optimum cooling at both the bottom and top of the enclosure.
200 W of power in a space-saving design Vepac Electronics
Manufacturing / Production Technology, Hardware & Services
The Hakko FX-972 Soldering Station delivers high-performance soldering in a compact package, making it suitable for a wide range of soldering applications.
Read more...FineX: Makes shielding clear Avnet Abacus
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Panasonic Industry launches high-transparency, low-resistance, flexible transparent conductive film for electromagnetic wave shield with pre-applied OCA.
Read more...Collaboration is now critical RS South Africa
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The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.
Read more...Disruption is the new normal. Effortless is the new competitive advantage. Seven Labs Technology
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Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.
Read more...World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
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At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
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Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
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The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
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BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
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