Manufacturing / Production Technology, Hardware & Services


Compact enclosure system offers many possibilities for interior installation

16 November 2005 Manufacturing / Production Technology, Hardware & Services

With Rittal's compact system enclosure, the CM (Compact-Medium), the company offers a comprehensive new enclosure series for the configuration of compact controllers, featuring an extensive range of interior installation and cable entry options. As an alternative to the large enclosures in its AE series and as a successor to the AK series, the CM is compatible with TS 8 installation components and the extensive range of Rittal system accessories.

Special rails for interior installation that are attached to the enclosure side panels using existing threaded bolts ensure maximum flexibility. TS 8 system punchings support the mounting of TS 8 installation components such as punched sections with mounting flanges, punched rails and support strips. Further benefits include more space, more stability and more options for cable entry, thanks to the large opening in the base and the numerous possible combinations of the gland plates.

Rittal's innovative detail for rapid attachment of the mounting plate, which is simply inserted underneath and secured from above with a clip, leaves both hands free to screw-fasten the mounting plate. Spot-welded perforated mounting strips on a 25 mm pitch pattern on both doors are an additional feature for universal interior installation. Additionally, the folding lever handle does not take up any rotation space, and therefore makes optimum use of the door surface for installed equipment.

The CM system enclosure is available in a single-door version in widths 600 and 800 mm and heights 800, 1000 and 1200 mm, as well as in a two-door version in widths 1000 and 1200 mm and heights 1000, 1200 and 1400 mm. As for the depths, users may choose between 300 and 400 mm versions. The triple surface treatment with phosphating, electrophoretic-dipcoat priming and powder coating ensures comprehensive protection from corrosion and resistance to lubricants, machining agents and detergents.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved