Winbond Electronics, locally represented by KH Distributors, has announced that NextFlash Technologies and National Semiconductor's Advanced PC (APC) division, have both joined Winbond Electronics.
National's APC division is a leading supplier of ICs, including I/O controllers, embedded controllers and integrated trusted platform modules (TPM) for notebook, desktop and server platforms. This acquisition will create momentum for faster growth of WinBond's Logic IC Business Group, it says.
With its TrustedI/O TPM technology, Winbond's competency in the PC and PC Peripherals markets is greatly enhanced. As a result, it says that it will be able to provide increasingly advanced technologies as well as cost-effective products for notebook, desktop and server customers.
NexFlash is a developer and provider of Serial Flash Memory products for today's emerging electronic applications. The company's spiFlash memories range in density from 1 M-bit to 32 M-bit and are tailored for serial code storage in applications such as DVD/CD drives, hard disk drives, wireless LANs, network cards, DSL modems, printers, set-top boxes, FPGAs and more. These products are all manufactured by Winbond's 0,18 μm WinStack process technology in Winbond's 8" fab.
Electronic News Digest
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A brief synopsis of current global news relating to the electronic engineering fields with regards to company finances, general company news, and engineering technologies.
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