Thermal management products available for almost any application
22 February 2006
Circuit & System Protection
With the acquisitions of Orcus, Warth and Thermagon, Laird Technologies has become a force in the thermal management market.
Thermagon, since being launched in 1992, has led the way in the thermal gap filler pad market growing to be the global leader for computer systems, power converters, telecommunications hardware, and automotive electronics. Orcus pioneered phase-change thermal management materials since its inception in the mid '80s. Warth, based in the UK, has had a strong position in Europe selling its thermally-conductive insulators and accessories into many power conversion applications. With this combination, Laird Technologies has expanded to offer one of the broadest lines of thermally-conductive products over a wide range of industries worldwide.
Most of the thermal interface materials are supplied as sheets ranging in thickness from 0,0762 to 5,08 mm. Laird's thickness and dimensional configurations are custom-designed to meet each customer's needs.
To address the demanding thermal needs of the most sophisticated devices in electronics, phase change material (T-pcm) or thermal grease (T-grease) is recommended. These products provide thin bondlines and good surface wetting to produce the lowest thermal resistances. They are generally 0,127 mm thick or less and used between a single device and a heatsink.
On the other hand, gap fillers find use in most market segments and are usually 0,51 mm or greater in thickness and vary in their thermal conductivity, softness, compressibility, and ease of use. The Thermagon market performance leader is T-pli, the highest thermal conductivity polymer-based interface pad available. Other product families include T-flex and T-putty.
For applications that require high dielectric strength such as power transistors, Laird offers the T-gon products such as T-gon 200, T-gon K52 or T-gon CP230. These thermal insulators are rough, reliable and cover the widest range of performance needs.
For very high watt density applications that generate excessive heat, the PCB itself can be made thermally conductive using the T-lam system. The system provides for free-standing thermally-conductive pre-pregs, core laminates and metal-based circuit board laminates. These products are designed into single, double and multiplayer PCBs.
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