Passive Components


Industry's first 100 μF MLCC in EIA 1206

22 February 2006 Passive Components

Taiyo Yuden offers two new high-capacitance multilayer ceramic capacitors - said to be the industry's first 100 μpF device in EIA 1206 case size, and the industry's first 47 μF MLCC in 0805. The 100 μF 1206 size device is 59% smaller by volume (36% smaller footprint) than the previously smallest 100 μF capacitor in 1210 case size (3,2 x 2,5 x 2,5mm).

Highly-suited for smoothing CPU power circuits in PCs, servers and other microprocessor-based electronics equipment, the 100 μF device meets the market demand for higher capacitance in smaller form factors. The 47 μF device in 0805, to cite another example, represents a 55% surface area reduction versus 47 μF-rated devices in 1206 - an ideal solution for high-density surface-mount requirements in cellphones and other ultra-portable designs.

Taiyo Yuden's advanced material science techniques achieved an unprecedented degree of device miniaturisation. A new material technology, pioneered in 2004, resulted in the ability to fabricate dielectric layers of less than one micrometre thickness. From a reliability standpoint, using Nickel (Ni) internal and external electrodes improves solderability and heat resistance characteristics, while nearly eliminating migration. Additionally, the non-polarised electrodes of the AMK series allow mounting regardless of device orientation, simplifying manufacturability.





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