Industry's first 100 μF MLCC in EIA 1206
22 February 2006
Passive Components
Taiyo Yuden offers two new high-capacitance multilayer ceramic capacitors - said to be the industry's first 100 μpF device in EIA 1206 case size, and the industry's first 47 μF MLCC in 0805. The 100 μF 1206 size device is 59% smaller by volume (36% smaller footprint) than the previously smallest 100 μF capacitor in 1210 case size (3,2 x 2,5 x 2,5mm).
Highly-suited for smoothing CPU power circuits in PCs, servers and other microprocessor-based electronics equipment, the 100 μF device meets the market demand for higher capacitance in smaller form factors. The 47 μF device in 0805, to cite another example, represents a 55% surface area reduction versus 47 μF-rated devices in 1206 - an ideal solution for high-density surface-mount requirements in cellphones and other ultra-portable designs.
Taiyo Yuden's advanced material science techniques achieved an unprecedented degree of device miniaturisation. A new material technology, pioneered in 2004, resulted in the ability to fabricate dielectric layers of less than one micrometre thickness. From a reliability standpoint, using Nickel (Ni) internal and external electrodes improves solderability and heat resistance characteristics, while nearly eliminating migration. Additionally, the non-polarised electrodes of the AMK series allow mounting regardless of device orientation, simplifying manufacturability.
Further reading:
SMT flat-wire inductor for automotive electronics
Passive Components
Würth Elektronik introduces its new WE-SFIA series of flat-wire inductors in 2010, 2013, and 2016 packages.
Read more...
Nanocrystalline cores for cable assembly
Passive Components
Conventional MnZn and NiZn ferrite cores for cable assembly are now complemented by nanocrystalline cable cores.
Read more...
Heat sinks for power-electronics and IC components
Passive Components
Würth Elektronik introduces heat sinks for power-electronics and IC components.
Read more...
Cooling solutions for modern electronics
Future Electronics
Passive Components
As electronic systems become more compact and powerful, effective thermal management has become a critical aspect of product design.
Read more...
DC-link capacitors with ultra-low inductance
Electrocomp
Passive Components
TDK Corporation recently released its new series of MKP DC high-frequency film capacitors, a high-performance DC link capacitor platform for next-generation SiC-based power electronics.
Read more...
Generating negative voltages from a positive supply
Altron Arrow
Editor's Choice Passive Components
It is common for IoT devices, industrial sensors, meters, and medical equipment to require both a positive and negative voltage, and this article explains the options available to produce a negative rail from a positive rail supply.
Read more...
High-precision thick-film resistors
Avnet Silica
Passive Components
The new Panasonic ERJPC high precision thick-film resistors series deliver accuracy levels previously only achievable with thin film technology, offering customers higher power density and cost-effective performance.
Read more...
Semi-shielded power inductors
RS South Africa
Passive Components
The SDCx family from Eaton includes the SDCL and SDCH series of semi-shielded power inductors designed for reliable performance in consumer, industrial, energy, and medical applications.
Read more...
Compact high-current power inductor
EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...
Tiny noise suppression filters
RS South Africa
Passive Components
TDK Corporation recently announced its latest noise suppression filters of the MAF0603GWY series, which measure only 0,6 x 0,3 x 0,3 mm.
Read more...