Osram Opto Semiconductors has developed a new high-output lighting LED module. The Ostar Lighting LED, equipped with four or six series-connected chips has a hexagonal shape that allows for high packing densities. The six-chip version with lens delivers 420 lumen from an operating current of 700 mA. This is brighter than a 20 W low-voltage halogen lamp, according to Osram, therefore making LEDs suitable for use in more and more general lighting applications.
The specially developed hemispherical lens improves the efficiency with which light is emitted without affecting the beam characteristics. Basic versions without lenses are available for customer-specific optics. The white light colour is constant from every viewing angle and comes from colour conversion based on the chip coating method.
The six-chip versions of these high-output LEDs produce 420 lumen with a lens and 300 lumen without a lens, in each case at an operating current of 700 mA and an output of 15 W. The four-chip version produces 280 lumen with the lens and 200 lumen without the lens, in each case at an operating current of 700 mA and an output of 10 W.
For more information contact EBV Electrolink, +27 (0)21 402 1940.
General-purpose MCU with RISC-V architecture EBV Electrolink
DSP, Micros & Memory
Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
Read more...AI-native IoT platform launched EBV Electrolink
AI & ML
These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
Read more...Serial SRAM up to 4 MB EBV Electrolink
DSP, Micros & Memory
The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
Read more...Microchip expands its mSiC solutions EBV Electrolink
Power Electronics / Power Management
The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
Read more...Powering up the intelligent edge EBV Electrolink
DSP, Micros & Memory
STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
Read more...Mouser broadens its LED lineup
Opto-Electronics
Mouser has broadened its LED lineup with diverse solutions designed to support lighting, medical, and smart home applications.
Read more...Flash for AI EBV Electrolink
AI & ML
SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...InnoSwitch5 Offline Flyback Switcher IC EBV Electrolink
Power Electronics / Power Management
ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
Read more...IGBT power module EBV Electrolink
Power Electronics / Power Management
The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
printer friendly version