W.L. Gore & Associates offer an innovative multicavity shield that it claims solves many of the problems associated with today's existing shielding technologies.
The company's GORE snapSHOT board-level EMI shield consists of a lightweight, metallised plastic material that can be thermoformed to virtually any design. The shield is attached to the printed circuit board (PCB) via a patented attachment mechanism that uses individual solder spheres as snap features. The shield is metallised with tin on the outside only (leaving the inside insulative), resulting in narrower ground traces, reduced space between components, and reduced thickness when compared to existing shielding solutions.
The product installs after the SMT reflow process, which allows for easy component inspection or repair, and it can be readily removed by hand. In addition to manufacturing flexibility, the manufacturer claims that the GORE snapSHOT board-level EMI shields have superior shielding performance when compared to perforated, soldered metal cans. See the graph.
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