IR underheater enables manual soldering without temperature stress
3 May 2006Manufacturing / Production Technology, Hardware & Services
The compact Hot-Beam-03 Underheater, developed by Martin, uses the company's Rapid-IR Technology, which it says offers the user significantly faster and relaxed manual soldering.
Anyone investing in new soldering equipment has to take account of EU Guidance 2002/95/EG. With 'lead-free' solder requiring a soldering iron tip temperature increase of 50°C, causing higher wear and shorter useful life, the Hot-Beam-03 can help solve these problems by splitting the heat energy input equally between top and bottom.
The Hot-Beam-03 heats the board at the maximum permitted rate and maintains the PCB at a predetermined temperature of up to 150°C. This underheater avoids components overheating, improves wetting and significantly extends solder tip life.
Since use of the Hot-Beam-03 reduces the required soldering iron tip temperature, this also saves on flux, as it is not used up as quickly. Especially during the wetting phase of the solder joint, flux remains present in sufficient quantities.
The Hot-Beam-03 underheater is compact, measuring only 290 x 140 x 40 mm, allowing it to find space even on small workbenches. A number of different variants are available for supporting PCBs. The new Handy-Fix-03K consists of a static safe baseplate and a magnetic adjustable board clamp. PCBs are located by spring clips, which make locating boards simple.
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