14 June 2006Enclosures, Racks, Cabinets & Panel Products
One of the most important factors with AdvancedTCA is cooling. AdvancedTCA systems distinguish themselves through fast processors, which have the annoying habit of creating a lot of heat, resulting in systems having to be cooled.
In order to achieve the most efficient cooling concept, Schroff has developed two thermal simulation boards to enable thermal simulation under real conditions in systems that have been partly- or fully-equipped with boards.
The performance losses are defined according to PICMG standard 3.x as 200 W for the front boards and 50 W for the rear boards. The dimensions of the boards are 8U, 6HP, 280 mm deep and 8U, 6HP, 70 mm deep. The user can choose between a thermal load of 1/3 or 2/3, or a full load for the front boards and for RTM boards have the choice between half and full load. Nine temperature measurement points (T1 to T9) are integrated on the boards, which can be taken from the front panel.
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