Temperature sensor IC market heats up
12 July 2006
News
Market intelligence supplier, Databeans, has just released its first market report on the market for temperature sensor ICs, titled '2006 Temperature Sensors'.
In this study, it discusses trends and emerging market opportunities for thermal management devices.
Today's electronic application designs are shrinking in size at a rate similar to the growing complexity of the devices inside. With more complex designs residing on smaller boards, temperature management becomes a real issue. The importance of thermal management is gaining momentum, providing a strong market opportunity for devices servicing this function.
Temperature measurement in electronics has been around for years. Prior to the introduction of integrated temperature sensing circuits, this function was performed by thermocouplers and RTDs (resistive temperature detectors). Both are passive devices, a market on the decline, as integrated solutions continue to reach competitive price points.
Temperature sensors have been used in many embedded applications, and of course, in the more common computer processor thermal management function. Obvious applications include power supplies, computers, peripherals, automotive, and industrial equipment. With lower power products on the market, new applications are uncovered, such as battery powered GPS instruments, and even high volume wireless handsets.
Databeans estimates the current market for temperature sensor ICs at $674m. Growing at an aggressive average annual growth rate of 20% each year, this market may reach nearly $2 bn in the next five years.
The research group also finds that temperature sensor revenue growth leads all other sensor categories. Automotive and communications markets drive demand, it says, while volumes are maintained in the computer space.
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
printer friendly version