Breakthrough in ultra-thin leadless packaging

26 July 2006 Manufacturing / Production Technology, Hardware & Services

Royal Philips Electronics has claimed a breakthrough in ultra-thin leadless packaging (UTLP) with two new packages for Logic and RF applications: MicroPakII and SOD882T. MicroPakII is the world's smallest leadless Logic package at a size of 1,0 mm², with a pad pitch of 0,35 mm, while the SOD882T for RF applications is an even smaller package with a footprint of 0,6 mm².

Philips developed a special substrate and a dedicated etching process. According to the company, the substrate enables a 33% reduction in package size for the MicroPakII over its predecessor MicroPak, freeing board space for additional components and functions. With a contact area of 0,298 mm², it also provides a contact-footprint ratio of 30%, nearly double that of most leaded and leadless packages in its class.

The special substrate technology allows for an increased 'silicon to plastic' ratio, enabling the use of bigger crystals within the same footprint, increasing performance without sacrificing valuable board space. UTLP also offers less parasitic capacitance and inductance, making it ideally suited for high frequency applications (up to 24 GHz).

Philips is making its ultra-thin packages available for diodes and transistors in RF applications at a height of 0,4 mm for small-form-factor devices. The UTLP platform is also ideally suited to meet the demand for extremely thin and small, highly integrated power management products for mobile phones and portable media players.

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