Passive Components


Multilayer ceramic chip coil is smallest

9 August 2006 Passive Components

TDK's new MLG0402 chip coils are claimed to be the industry's smallest multilayer ceramic chip coils. The inductors, designed for ultra high frequency, represent a major breakthrough in miniaturisation with approximately 70% less volume and 55% less mounting area than the 0603-sized coils currently in widespread use.

The components also offer a superior inductance range, up to a maximum of 12 nH.

In conjunction with the rapid miniaturisation of mobile communications devices such as cellphones as well as the incorporation of multiple functions, there have been strong demands for chip coils to be made more compact. TDK has used multilayering technologies to deliver the MLG0402 series which comprises 14 products with inductances from 1,0 nH to 12 nH.

The MLG0402 chip coils measure 0,4 x 0,2 x 0,2 mm (all dimensions ±0,02 mm) with tolerance of ±0,3 nH and ±5%, and operating temperature range -55 to +125°C. The components are lead-free.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Chip capacitors for high-voltage applications
RS South Africa Passive Components
TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.

Read more...
How ADI battery management solutions empower safer, smarter robots
Altron Arrow Editor's Choice Power Electronics / Power Management
Choosing an appropriate battery pack and its accompanying battery management system is a critical decision in designing an autonomous mobile robot.

Read more...
Highest density automotive-grade power modules
Altron Arrow Power Electronics / Power Management
Vicor has released three automotive-grade power modules for 48 V EV systems, which deliver industry-leading power density.

Read more...
MOSFET for automotive applications
Altron Arrow Power Electronics / Power Management
Infineon’s OptiMOS 7 100 V is offered in the company’s versatile and robust, high-current SSO8 5 x 6 mm2 SMD package.

Read more...
Moulded inductors
Future Electronics Passive Components
Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.

Read more...
16-bit voltage output denseDAC
Altron Arrow Analogue, Mixed Signal, LSI
The AD5766 uses a versatile four-wire serial interface that operates at clock rates of up to 50 MHz for write mode, and is compatible with SPI, QSPI, MICROWIRE, and DSP interface standards.

Read more...
New components from KEMET available from TME
Passive Components
Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.

Read more...
Silicon Carbide MOSFET discrete devices
Altron Arrow Power Electronics / Power Management
Infineon offers a range of CoolSiC MOSFET discrete devices from 650 to 2000 V, ideally suited for hard- and resonant-switching topologies.

Read more...
Miniature reed relay with 80 W rating
Passive Components
Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.

Read more...
Development platform with LCD touchscreen
Altron Arrow DSP, Micros & Memory
The STM32H573I-DK Discovery kit from STMicroelectronics is a complete demonstration and development platform for the STM32H573IIK3Q microcontroller, featuring an Arm Cortex-M33 core with Arm TrustZone.

Read more...