Altera has expanded its MAX II device family to address the growing portable applications market with new ultra-small packages and a new power-down capability. The MAX II EPM240, EPM570 and EPM1270 devices are now available in 100-pin and 256-pin 0,5 mm Micro FineLine BGA (MBGA) packages and 100-pin 1,0 mm FineLine BGA (FBGA) package. Using the new MBGA packages, designers can integrate 50% more user I/O and logic elements for a given board area, on average, than industry standard CPLD solutions, claims Altera. MAX II CPLDs also offer extremely lowest dynamic power and a power-down capability to conserve battery life. Designers can further reduce system cost by using the new packages and MAX II devices' differentiating features, it adds, which includes high logic density, an on-chip voltage regulator and an internal oscillator, to integrate discrete devices and minimise the number of power rails.
MCU for noisy environments EBV Electrolink
DSP, Micros & Memory
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...Battery monitoring and balancing IC EBV Electrolink
Power Electronics / Power Management
The TLE9009DQU from Infineon is a multi-channel battery monitoring and balancing IC crafted for Li-Ion battery packs.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Power IC supplies 1650 W EBV Electrolink
Power Electronics / Power Management
Power Integrations has announced a two-fold increase in power output from the HiperLCS-2 chipset with the new device now being able to deliver up to 1650 W of continuous output power.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.