Freescale Semiconductor has announced it has achieved a milestone in microcontroller (MCU) technology to help fuel innovation in next-generation powertrain designs and other automotive control applications.
The company's MPC55xx automotive controller family built on its Power Architecture technology now includes the MPC5566 - the first 32-bit MCU to integrate 3 MB of flash memory.
The MPC5566 microcontroller features the largest embedded flash memory on an MCU in the industry today. By addressing the growing need for more embedded memory in automotive applications, it enables developers to design more advanced powertrain engine control systems that increase fuel efficiency and reduce harmful exhaust emissions. Large on-chip flash arrays provide application developers with a high-performance solution to support more sophisticated, memory-intensive engine control functionality.
"Powertrain applications are the harshest of automotive electronic environments," said Mark Fitzgerald, an automotive electronics analyst at Strategy Analytics. "Semiconductor suppliers who can deliver reliable, high-performance microcontrollers that meet the demanding performance and efficiency requirements of leading automotive electronics manufacturers will be well positioned to succeed in the powertrain market."
The MPC5566 controller is Freescale's seventh device in the MPC55xx family. The family is designed to provide significant performance gains over today's controller solutions, while helping to ensure a smooth migration path to higher-performance applications. Members of this scalable family of powertrain controllers are pin- and code-compatible, enabling re-use of code across multiple applications.
"Freescale is the first to offer large flash arrays qualified for automotive temperatures, and we have now delivered the industry's first 3 MB device," said Mike McCourt, vice president and general manager of Freescale's microcontroller division.
The MPC55xx family is based on the power-efficient e200 core, built on Power Architecture technology. In February, ST Microelectronics and Freescale announced a collaboration agreement that outlines joint design of 32-bit automotive MCUs based on Power Architecture technology, including future 90 nm products with dual-source options available for these devices. Additionally, General Motors announced in 2004 that it will use the MPC55xx family in future GM powertrain engine control systems around the world.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version