20 September 2006Manufacturing / Production Technology, Hardware & Services
Heraeus' Circuit Materials Division has introduced newly-developed thermosetting, one-component, silver conductive adhesives. The new PC 3000-Series is solvent-free and its outstanding feature is an excellent thermal conductivity of >5 W/m·K.
The PC 3000-Series is well-suited for screen and stencil printing, and for dispensing. The curing temperatures are within the range of 120°C and 150°C, and the curing times are 10 to 20 minutes.
A high ionic purity enables the adhesion of bare ICs. The outgassing of PC 3000-Series is <1% and therefore, these conductive adhesives achieve good results in wire bonding applications of ICs onto bonding surfaces nearby, without prior cleaning.
The application fields of the PC 3000-Series are the automotive, telecommunication, and component industry.
200 W of power in a space-saving design Vepac Electronics
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The Hakko FX-972 Soldering Station delivers high-performance soldering in a compact package, making it suitable for a wide range of soldering applications.
Read more...FineX: Makes shielding clear Avnet Abacus
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Panasonic Industry launches high-transparency, low-resistance, flexible transparent conductive film for electromagnetic wave shield with pre-applied OCA.
Read more...Collaboration is now critical RS South Africa
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The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.
Read more...Disruption is the new normal. Effortless is the new competitive advantage. Seven Labs Technology
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Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.
Read more...World-first 016008 mm component placement
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Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
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At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
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Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
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The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
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BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
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By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
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