Manufacturing / Production Technology, Hardware & Services


Lead-free no-clean solder pastes have wide process window

4 October 2006 Manufacturing / Production Technology, Hardware & Services

A new lead-free, no-clean solder paste that promotes wetting and minimises defects with tin/silver/copper alloy soldering has been unveiled by the Circuit Materials Division (CMD) of Heraeus. This new line of solder pastes, the F640 Series, has a wide process window, and is thus able to compensate for process variations in printing, component placement and soldering.

According to the company, this lead-free paste series provides industry-leading wetting on a variety of surfaces and finishes and leaves behind a clear residue. This reduces processing costs, makes set-up easy and saves time. Offering minimal slumping and superior print-to-print consistency, the F640 Series can also be reflowed in air or nitrogen environments.



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