At the electronica Trade Show, Infineon Technologies unveiled a new 'miniature' silicon microphone for consumer and computer communications devices that is approximately one-half the size and operates on just one-third the power of conventional electret condenser microphone (ECM) microphones. Based on silicon MEMS (micro-electrical-mechanical system) technology, the new microphone achieves the same acoustic and electrical properties as conventional microphones, says Infineon, but is more rugged, exhibits higher heat resistance and is much more immune to vibrations and shocks. These silicon MEMS microphones can withstand temperatures of up to 260°C and can be soldered by automation without difficulty onto any standard PCBs. A 1,5 to 3,3V power supply cuts the miniature microphone's power consumption to about one third (70 μA) that of typical ECM microphones. Acoustic properties given are: high signal-to-noise ratio (59 dB(A)) and high sensitivity (10 mV/Pa). The compact, flat package (4,72 x 3,76 x 1,5 mm) can easily be configured to form arrays needed for directional microphones, says Infineon.
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