24 January 2007Manufacturing / Production Technology, Hardware & Services
YESTech's YTX-3000 HXR X-ray system combines extremely high resolution and magnification with the power and ease of use of the company's YTX-3000 model, to provide SMT and semiconductor manufacturers with a cost-effective high resolution X-ray inspection solution.
Featuring an open-tube transmission target X-ray source with integral high-voltage power supply and computer-controlled operation, the HXR system can resolve sub-micron features with zoom magnifications up to 2400 times. The source is designed for minimum maintenance, with easily replaceable filament and target assembly.
The 3000 HXR is available with a 4 or 5 axis sample manipulator and a 380 x 500 mm x-y travel for samples up to 2,3 kg in weight. Full 360° of rotation and 30° of tilt are available and computer-controlled motor drives provide a wide range of motion, from ultra-slow use at high magnifications, to high speed for travel over large distances.
Each YTX system is equipped with YESTech's proprietary machine vision technology for fully automated inspection of BGA and flip chip devices. Other optional inspections include die attach, bond wire and correct assembly verification. The system covers X-ray inspection for: BGA/flip chip; solder joint quality; voids; bond wires; electronic and sealed assemblies.
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