Tektronix acquires Digianswer Bluetooth protocol analyser
24 January 2001
News
Tektronix has announced an agreement to acquire the Bluetooth SIG (Special Interest Group) approved protocol analyser product from Digianswer, a subsidiary of Motorola based in Nibe, Denmark. In addition, the companies will form a five-year partnership to further advance Bluetooth technology and applications.
Bluetooth wireless technology will enable users to connect a wide range of computing and telecommunications devices easily and quickly, without the need for cables. To date, more than 2000 telecommunications, computing and consumer products companies have joined as members of the Bluetooth SIG to drive development of the technology and bring it to market.
The acquired Bluetooth protocol analyser joins a suite of Tektronix products aimed at enabling the rapid adoption of Bluetooth technology in the electronics industry. In addition to further development of the protocol analyser, the company plans to leverage this advanced technology across its entire product portfolio to provide more complete design and debug solutions for Bluetooth developers.
"Bluetooth could revolutionise the way we apply technology in our everyday life. However, adoption of Bluetooth technology has been slowed by the inability to accurately and rapidly test products before they come to market," said Rick Wills, President and CEO, Tektronix. "Tektronix' expertise in test and measurement, and Digianswer's industry-leading Bluetooth technology, will provide the industry with the test equipment needed to accelerate the development of Bluetooth products and services."
For further information contact Channels, (011) 254 8360.
Further reading:
Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.
Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.
Read more...
Siemens acquires Canopus AI
ASIC Design Services
News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.
Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.
Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
Read more...
printer friendly version